Our systems are now restored following recent technical disruption, and we’re working hard to catch up on publishing. We apologise for the inconvenience caused. Find out more

Recommended product

Popular links

Popular links


Wide-Bandgap Electronic Devices

Wide-Bandgap Electronic Devices

Wide-Bandgap Electronic Devices

Volume 622:
Randy J. Shul, Sandia National Laboratories, New Mexico
Fan Ren, University of Florida
Wilfried Pletschen, Fraunhofer-IAF, Germany
Masanori Murakami, Kyoto University, Japan
June 2014
622
April 2001
Unavailable - out of print
Paperback
9781107413054
Out of Print
Paperback
exc GST
Hardback

    Interest in wide-bandgap semiconductors for high-power/high-temperature electronics remains prominent. For such applications, SiC is by far the most mature semiconductor material. GaN and diamond, however, have also become prime candidates. While diamond has several advantages over the other two materials, producing large single crystals, as well as the inability to achieve n-type doping, have limited device fabrication. For GaN, recent advances in crystal growth and processing capabilities, as well as excellent transport properties, have yielded a great deal of device development, yet thermal conduction remains an issue. SiC has excellent thermal conductivity, high-breakdown voltages, and well-developed substrates and processing techniques. This book deals with a wide range of technical activity in the area of wide-bandgap high-power/high-temperature electronic devices and covers topics including the fabrication and performance of GaN-based and SiC-based devices, as well as issues related to growth, characterization, and processing of wide-bandgap materials. Several summaries of the current status of the field are provided.

    Product details

    June 2014
    April 2001
    Paperback
    9781107413054
    542 pages
    229 × 152 × 28 mm
    0.72kg
    Unavailable - out of print
      Editors
    • Randy J. Shul , Sandia National Laboratories, New Mexico
    • Fan Ren , University of Florida
    • Wilfried Pletschen , Fraunhofer-IAF, Germany
    • Masanori Murakami , Kyoto University, Japan