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Materials Reliability in Microelectronics III

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Materials Reliability in Microelectronics III

Materials Reliability in Microelectronics III

Volume 309:
Kenneth P. Rodbell, IBM T J Watson Research Center, New York
William F. Filter, Sandia National Laboratories, Albuquerque, New Mexico
Harold J. Frost, Dartmouth College, New Hampshire
Paul S. Ho, University of Texas, Austin
June 2014
309
Available
Paperback
9781107409484
AUD$45.41
exc GST
Paperback
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    June 2014
    Paperback
    9781107409484
    514 pages
    229 × 152 × 26 mm
    0.68kg
    Available

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    About the authors
      Editors
    • Kenneth P. Rodbell , IBM T J Watson Research Center, New York
    • William F. Filter , Sandia National Laboratories, Albuquerque, New Mexico
    • Harold J. Frost , Dartmouth College, New Hampshire
    • Paul S. Ho , University of Texas, Austin

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