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In Situ Process Diagnostics and Intelligent Materials Processing

In Situ Process Diagnostics and Intelligent Materials Processing

In Situ Process Diagnostics and Intelligent Materials Processing

Volume 502:
Peter A. Rosenthal, On-Line Technologies, Inc., East Hartford, Connecticut
Walter M. Duncan, Texas Instruments, Inc., Dallas
John A. Woollam, University of Nebraska, Lincoln
June 2014
502
July 1998
Unavailable - out of print
Paperback
9781107413566
Out of Print
Paperback
USD
Hardback

    This book, first published in 1998, focuses on the rapidly developing field of sensor technology for process monitoring and control during fabrication of advanced materials and structures. Research in sensor driven, closed-loop control of the fabrication process (i.e., process-state monitoring), as well as product-state (e.g., wafer-state) monitoring are discussed. Featured are process techniques that include chemical vapor deposition (CVD), metalorganic chemical vapor deposition (MOCVD), plasma-enhanced chemical vapor deposition (PECVD), molecular beam epitaxy (MBE), rapid thermal processing (RTP), reactive-ion and plasma etching, electron beam evaporation, pulsed laser deposition (PLD), and sputtering. Materials of interest include electronic and optical thin films such as semiconductors, epitaxial oxides, metals and dielectrics, as well as particles and nanostructured materials. Sensing techniques for monitoring variables such as temperature, composition, optical properties, film thickness and particle-size distribution are highlighted. Topics include: sensor technologies and semiconductor diagnostics; sensor technologies and thin-film diagnostics; in situ diagnostics of oxide film growth and processes and intelligent processing of electronic ceramics.

    Product details

    June 2014
    July 1998
    Paperback
    9781107413566
    306 pages
    229 × 152 × 16 mm
    0.41kg
    Unavailable - out of print
      Editors
    • Peter A. Rosenthal , On-Line Technologies, Inc., East Hartford, Connecticut
    • Walter M. Duncan , Texas Instruments, Inc., Dallas
    • John A. Woollam , University of Nebraska, Lincoln