Our systems are now restored following recent technical disruption, and we’re working hard to catch up on publishing. We apologise for the inconvenience caused. Find out more

Recommended product

Popular links

Popular links


Mechanical Behavior of Materials and Structures in Microelectronics

Mechanical Behavior of Materials and Structures in Microelectronics

Mechanical Behavior of Materials and Structures in Microelectronics

Volume 226:
Ephraim Suhir, AT&T Bell Laboratories, New Jersey
Robert C. Cammarata, The Johns Hopkins University
Deborah D. L. Chung, State University of New York, Buffalo
Masahiro Jono, Osaka City University, Japan
June 2014
226
Paperback
9781107409866
Out of Print
Paperback
Hardback

    The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

    Product details

    June 2014
    Paperback
    9781107409866
    472 pages
    229 × 152 × 24 mm
    0.63kg
    Unavailable - out of print

    Table of Contents

    • Part I. Metals
    • Part II. Organic Materials
    • Part III. Semiconductors
    • Part IV. Thin Films and Coatings
    • Part V. Stress-Strain and Fracture Analyses
    • Part VI. Reliability Issues.
      Contributors
    • Semyon Vaynan, Morris E. Fine, J. K. Tien, A. I. Attarwala, Yi-Hsin Pao, Kuan-Luen Chen, An-Yu Kuo, Cynthia M. Melton, Susan M. Yarling, Carl J. Raleigh, Wang Chunqing, Qian Yiyu, Jiang Yihong, Tomohiro Uno, K. Tatsumi, K. Mizuno, O. Kitamura, Y. Ohno, Fang Hongyuan, C. P. Wong, A. Bar-Cohen, Devin E. Mix, Mingguang Zhu, D. D. L. Chung, R. R. Lagasse, R. S. Chambers, T. R. Guess, D. J. Plazek, C. Bero, Boon Wong, David C. Sandkulla, Kun Tong, Jeffrey E. Taylor, Richard J. Farris, A. S. Jordan, V. Swaminathan, S. M. Prokes, Jun Ming Hu, Michael Pecht, Donald Barker, Tetsuya Ohashi, Naoyuki Honda, Jeng-Maw Chiou, J. G. Huang, R. J. Jaccodine, J. H. Huang, S. A. Schwarz, C. L. Schwartz, R. Bhat, T. W. Wu, B. S. Berry, W. C. Pritchet, Si Kamakhya P. Ghatak, Badal De, A. Jagota, M. F. Lemon, Y. H. Hu, Tsann Lin, V. Raman, M. Grant Norton, Paul G. Kotlua, Jian Li, Stuart McKernan, Kathryn P. B. Cracknell, C. Barry Carter, James W. Mayer, P. H. Townsend, T. M. Stokich, Jr, B. S. Huber, B. Yost, Che-Yu Li, Bette Bergman-Reuter, Tim Sullivan, Sarah E. Bobbin, J. W. Wagner, R. C. Cammarata, R. R. Kola, G. K. Celler, R. Ramesham, T. Roppel, C. Ellis, H. S. Koo, T. L. Kuo, D. H. Kuo, R. J. Lin, W. H. Lee, P. T. Wu, H. G. Bohn, W. Pill, K.-H. Robrock, W. Schilling, C.-K. Kwok, E. Kolawa, M. A. Nicolet, Ray C. Lee, E. Suhir, W. W. Gerberich, J. E. Angelo, R. R. Keller, A. W. Wowchak, P. I. Cohen, L. B. Freund, K. S. Kim, Masahiro Jono, Atsushi Sugeta, A. Chudnovsky, C. P. Bosnyak, C. S. Chen, Ronald E. Allred, William E. Warren, Guo-Quan Lu, Boris Mogilevsky, Tapan K. Gupta, Hideo Miura, Hiroshi Sakata, Shinji Sakata, J. Marschall, F. Milstein, G. Georgeson, V. Gerrish, David L. Davidson, C. C. Chao, R. Chleboski, E. J. Henderson, C. K. Holmes, J. P. Kalejs, T. S. Gross, M. Muraoka, H. Abé, V. N. Belomestnykh, O. L. Khasanov, Yu.P. Pokholkov, A. A. Bush, Beta Y. Ni, T. Y. Zhang, J. C. M. Li, M. A. Korhonen, P. Børgesen, C. Basa, W. R. LaFontaine, B. Land, J. K. Lee, C. A. Paszkiet, T. Nakagawa, H. Miyatake, T. Maeda, K. Kuroda, N. Tokushige, R. Inoue, J. Kudo, T. Ashida, R. G. Ross, Jr, L. C. Wen, G. R. Mon, E. Jetter, J. Winslow, L. G. Burrell, S. Kapur, I. Shareef, A. M. Conlon, C. P. Cameron, J. W. Lau

    • Editors
    • Ephraim Suhir , AT&T Bell Laboratories, New Jersey
    • Robert C. Cammarata , The Johns Hopkins University
    • Deborah D. L. Chung , State University of New York, Buffalo
    • Masahiro Jono , Osaka City University, Japan