Our systems are now restored following recent technical disruption, and we’re working hard to catch up on publishing. We apologise for the inconvenience caused. Find out more

Item added to bagSorry, there was a problem getting your bag informationItem cannot be purchased with the existing contents of your bagItem unavailable online
✕

was added to your bag.

Please try again.

Sorry, this item cannot be purchased in the same transaction as the existing items in your bag.

Please complete the purchase of the items currently in your bag and then add this item in a separate transaction or visit Shopping Help.

Sorry, this product is not currently available to buy online. Please visit Shopping Help.

View bag and checkout
Remove item
✕

Are you sure you want to remove from your bag?

Recommended product

Popular links

Popular links

Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics

All titles
Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics

Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics

Volume 1249:
J. W. Bartha
C. L. Borst
D. DeNardis
K. Kim
A. Naeemi
A. Nelson
S. S. Papa Rao
H. W. Ro
D. Toma
October 2010
1249
Hardback
9781605112268
$94.99
USD
Hardback
    Description

    Product details

    October 2010
    Hardback
    9781605112268
    0 pages
    0.682kg
    Out of stock in print form with no current plan to reprint

    Often bought together

    Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2011
    Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2011

    : Hardback

    Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009
    Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009

    : Hardback

    Science and Technology of Chemical Mechanical Planarization (CMP)
    Science and Technology of Chemical Mechanical Planarization (CMP)

    : Hardback

    Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
    Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics

    : Paperback

    Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.

    Often bought together

    cambridge core banner

    Related Journals

    Powder Diffraction
    Powder Diffraction

    : Journal

    Powder Diffraction is a quarterly journal published by the JCPDS-International Centre for Diffraction Data through Cambridge University Press. Powder Diffraction is a journal of practical technique, publishing articles relating to the widest range of application—from materials analysis to epitaxial growth of thin films and to the latest advances in software. Although practice is emphasized, theory is not neglected, especially as its discussion relates to better understanding of technique.2015 Impact Factor: 0.763

    Related Journals

    Also by this Author

    Contents
    Courses
    Resources
    Additional Information
    About the authors
      Editors
    • J. W. Bartha
    • C. L. Borst
    • D. DeNardis
    • K. Kim
    • A. Naeemi
    • A. Nelson
    • S. S. Papa Rao
    • H. W. Ro
    • D. Toma

    Browse by related subject

     
    ✕

    Sorry, this item cannot be purchased in the same transaction as the existing items in your cart.

    Please complete the purchase of the items currently in your cart and then add this item in a separate transaction or contact

    Customer Services