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Advanced Metallization and Processing for Semiconductor Devices and Circuits — II

Advanced Metallization and Processing for Semiconductor Devices and Circuits — II

Advanced Metallization and Processing for Semiconductor Devices and Circuits — II

Volume 260:
Avishay Katz, AT&T Bell Laboratories, New Jersey
Shyam P. Murarka, Rensselaer Polytechnic Institute, New York
Yves I. Nissim, France Telecom - CNET Bagneux, France
James M. E. Harper, IBM T J Watson Research Center, New York
June 2014
260
October 1992
Paperback
9781107409705
Out of Print
Paperback
USD
Hardback

    Product details

    June 2014
    October 1992
    Paperback
    9781107409705
    988 pages
    229 × 152 × 49 mm
    1.29kg
    Unavailable - out of print
      Editors
    • Avishay Katz , AT&T Bell Laboratories, New Jersey
    • Shyam P. Murarka , Rensselaer Polytechnic Institute, New York
    • Yves I. Nissim , France Telecom - CNET Bagneux, France
    • James M. E. Harper , IBM T J Watson Research Center, New York