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Thin Films — Stresses and Mechanical Properties X

Thin Films — Stresses and Mechanical Properties X

Thin Films — Stresses and Mechanical Properties X

Volume 795:
Sean G. Corcoran, Virginia Tech, Virginia
Young-Chang Joo, Seoul National University
Neville R. Moody, Sandia National Laboratories, California
Zhigang Suo, Harvard University, Massachusetts
No date available
795
Paperback
9781107409316
Paperback

    Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.

    Product details

    No date available
    Paperback
    9781107409316
    606 pages
    229 × 152 × 31 mm
    0.8kg
      Editors
    • Sean G. Corcoran , Virginia Tech, Virginia
    • Young-Chang Joo , Seoul National University
    • Neville R. Moody , Sandia National Laboratories, California
    • Zhigang Suo , Harvard University, Massachusetts