Our systems are now restored following recent technical disruption, and we’re working hard to catch up on publishing. We apologise for the inconvenience caused. Find out more

Item added to bagSorry, there was a problem getting your bag informationItem cannot be purchased with the existing contents of your bagItem unavailable online
✕

was added to your bag.

Please try again.

Sorry, this item cannot be purchased in the same transaction as the existing items in your bag.

Please complete the purchase of the items currently in your bag and then add this item in a separate transaction or visit Shopping Help.

Sorry, this product is not currently available to buy online. Please visit Shopping Help.

View bag and checkout
Remove item
✕

Are you sure you want to remove from your bag?

Recommended product

Popular links

Popular links

Advanced Interconnects and Contacts

All titles
Advanced Interconnects and Contacts

Advanced Interconnects and Contacts

Volume 564:
Daniel C. Edelstein, IBM T J Watson Research Center, New York
Takamaro Kikkawa, Hiroshima University, Japan
Mehmet C. Öztürk, North Carolina State University
King-Ning Tu, University of California, Los Angeles
Elizabeth J. Weitzman, Motorola Advanced Products Research and Development Laboratory, Texas
No date available
564
Hardback
9781558994713
Hardback
    Description

    Product details

    No date available
    Hardback
    9781558994713
    0 pages
    0.932kg

    Often bought together

    Materials, Technology and Reliability for Advanced Interconnects 2005
    Materials, Technology and Reliability for Advanced Interconnects 2005

    : Hardback

    Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics
    Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics

    : Hardback

    Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics
    Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics

    : Hardback

    Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics — 2004
    Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics — 2004

    : Hardback

    Often bought together

    cambridge core banner

    Related Journals

    Powder Diffraction
    Powder Diffraction

    : Journal

    Powder Diffraction is a quarterly journal published by the JCPDS-International Centre for Diffraction Data through Cambridge University Press. Powder Diffraction is a journal of practical technique, publishing articles relating to the widest range of application—from materials analysis to epitaxial growth of thin films and to the latest advances in software. Although practice is emphasized, theory is not neglected, especially as its discussion relates to better understanding of technique.2015 Impact Factor: 0.763

    Related Journals

    Also by this Author

    Contents
    Courses
    Resources
    Additional Information
    About the authors
      Editors
    • Daniel C. Edelstein , IBM T J Watson Research Center, New York
    • Takamaro Kikkawa , Hiroshima University, Japan
    • Mehmet C. Öztürk , North Carolina State University
    • King-Ning Tu , University of California, Los Angeles
    • Elizabeth J. Weitzman , Motorola Advanced Products Research and Development Laboratory, Texas

    Browse by related subject

     
    ✕

    Sorry, this item cannot be purchased in the same transaction as the existing items in your cart.

    Please complete the purchase of the items currently in your cart and then add this item in a separate transaction or contact

    Customer Services