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Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics

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Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics

Advanced Interconnects and Chemical Mechanical Planarization for Micro- and Nanoelectronics

Volume 1249:
J. W. Bartha
C. L. Borst
D. DeNardis
K. Kim
A. Naeemi
A. Nelson
S. S. Papa Rao
H. W. Ro
D. Toma
No date available
1249
Hardback
9781605112268
Hardback
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    No date available
    Hardback
    9781605112268
    0 pages
    0.682kg

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    Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009
    Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics — 2009

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    Science and Technology of Chemical Mechanical Planarization (CMP)
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    • J. W. Bartha
    • C. L. Borst
    • D. DeNardis
    • K. Kim
    • A. Naeemi
    • A. Nelson
    • S. S. Papa Rao
    • H. W. Ro
    • D. Toma

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