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Advanced Electronic Packaging Materials

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Advanced Electronic Packaging Materials

Advanced Electronic Packaging Materials

Volume 167:
Andrew T. Barfknecht , Conducrus, Inc., Sunnyvale, California
C. Julian Chen , IBM T J Watson Research Center, New York
Che-Yu Li , Cornell University, New York
Julian P. Partridge , IBM T J Watson Research Center, New York
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167
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9781558990555
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    Hardback
    9781558990555
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    0.818kg

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    • Andrew T. Barfknecht , Conducrus, Inc., Sunnyvale, California
    • C. Julian Chen , IBM T J Watson Research Center, New York
    • Che-Yu Li , Cornell University, New York
    • Julian P. Partridge , IBM T J Watson Research Center, New York

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