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Polymer Interfaces and Thin Films

Polymer Interfaces and Thin Films

Polymer Interfaces and Thin Films

Volume 710:
Alamgir Karim, National Institute of Standards and Technology, Maryland
Thomas P. Russell, University of Massachusetts, Amherst
Curtis W. Frank, Stanford University, California
Paul F. Nealey, University of Wisconsin, Madison
June 2014
710
October 2002
Paperback
9781107411951
Out of Print
Paperback
USD
Hardback

    Polymer interfaces are critical for many technological and industrial applications in thin films including microelectronics, packaging, automotive coatings and sensors. The structure and architecture of interfaces in thin films and bulk polymeric systems can be exceedingly complex. In thin films, the technological drive to diminish film thickness while simultaneously enhancing homogeneity, stability and adhesion, is a demanding challenge driving research in newer areas of nanofilled and controlled nanostructured and nanopatterned materials. Tailoring surface and interfacial properties is equally important for new developments in the traditional fields of bulk polymer blends, adhesion and wetting. There is a need to develop an understanding of interfacial phenomena with the ultimate goal of establishing structure-property relationships with quantitative predictive capabilities and this book discusses these challenges. Topics include: block copolymer films; theory, simulations and dynamics; polymer interfaces and thin films; adhesion and mechanical properties; self-assembly by polymeric films; self-assembly and electronic properties; lithographic, electronic properties; and nanoparticulate-filled films.

    Product details

    June 2014
    October 2002
    Paperback
    9781107411951
    306 pages
    229 × 152 × 16 mm
    0.41kg
    Unavailable - out of print
      Editors
    • Alamgir Karim , National Institute of Standards and Technology, Maryland
    • Thomas P. Russell , University of Massachusetts, Amherst
    • Curtis W. Frank , Stanford University, California
    • Paul F. Nealey , University of Wisconsin, Madison