Our systems are now restored following recent technical disruption, and we’re working hard to catch up on publishing. We apologise for the inconvenience caused. Find out more

Item added to bagSorry, there was a problem getting your bag informationItem cannot be purchased with the existing contents of your bagItem unavailable online
✕

was added to your bag.

Please try again.

Sorry, this item cannot be purchased in the same transaction as the existing items in your bag.

Please complete the purchase of the items currently in your bag and then add this item in a separate transaction or visit Shopping Help.

Sorry, this product is not currently available to buy online. Please visit Shopping Help.

View bag and checkout
Remove item
✕

Are you sure you want to remove from your bag?

Recommended product

Popular links

Popular links

Electronic Packaging Materials Science V

All titles
Electronic Packaging Materials Science V

Electronic Packaging Materials Science V

Volume 203:
Edwin D. Lillie, Microelectronics & Computer Technology Corporation, Austin, Texas
Paul S. Ho, IBM T J Watson Research Center, New York
Ralph Jaccodine, Lehigh University, Pennsylvania
Kenneth Jackson, University of Arizona
June 2014
203
June 1991
Paperback
9781107409996
$35.99
USD
Paperback
USD
Hardback
    Description

    Product details

    June 2014
    June 1991
    Paperback
    9781107409996
    484 pages
    229 × 152 × 25 mm
    0.64kg
    Available

    Often bought together

    Electronic Packaging Materials Science IV
    Electronic Packaging Materials Science IV

    : Paperback

    Electronic Packaging Materials Science IV
    Electronic Packaging Materials Science IV

    : Hardback

    Electronic Packaging Materials Science VII
    Electronic Packaging Materials Science VII

    : Hardback

    Materials, Integration and Packaging Issues for High-Frequency Devices
    Materials, Integration and Packaging Issues for High-Frequency Devices

    : Paperback

    Often bought together

    cambridge core banner

    Related Journals

    Powder Diffraction
    Powder Diffraction

    : Journal

    Powder Diffraction is a quarterly journal published by the JCPDS-International Centre for Diffraction Data through Cambridge University Press. Powder Diffraction is a journal of practical technique, publishing articles relating to the widest range of application—from materials analysis to epitaxial growth of thin films and to the latest advances in software. Although practice is emphasized, theory is not neglected, especially as its discussion relates to better understanding of technique.2015 Impact Factor: 0.763

    Related Journals

    Also by this Author

    Silicon Materials–Processing, Characterization and Reliability
    Silicon Materials–Processing, Characterization and Reliability

    Paul S. Ho

    :Paperback

    Out of Print
    View product
    Materials Reliability in Microelectronics III
    Materials Reliability in Microelectronics III

    Paul S. Ho

    :Paperback

    $33.99 USD
    View product
    Thin Films — Interfaces and Phenomena
    Thin Films — Interfaces and Phenomena

    Paul S. Ho

    :Hardback

    $40.99 USD
    View product
    Materials Reliability Issues in Microelectronics
    Materials Reliability Issues in Microelectronics

    Paul S. Ho

    :Hardback

    $38.99 USD
    View product

    Also by this Author

    Contents

    Look inside

    Courses
    Resources
    Additional Information
    About the authors
      Editors
    • Edwin D. Lillie , Microelectronics & Computer Technology Corporation, Austin, Texas
    • Paul S. Ho , IBM T J Watson Research Center, New York
    • Ralph Jaccodine , Lehigh University, Pennsylvania
    • Kenneth Jackson , University of Arizona

    Browse by related subject

     
    ✕

    Sorry, this item cannot be purchased in the same transaction as the existing items in your cart.

    Please complete the purchase of the items currently in your cart and then add this item in a separate transaction or contact

    Customer Services