Electronic Packaging Materials Science IV

Electronic Packaging Materials Science IV
Volume 154:
Ralph Jaccodine, Lehigh University, Pennsylvania
Kenneth A. Jackson, AT&T Bell Laboratories, New Jersey
Edwin D. Lillie, Microelectronics and Computer Technology Corporation, Austin, Texas
Robert C. Sundahl, Intel Corporation, Chandler, Arizona
Kenneth A. Jackson, AT&T Bell Laboratories, New Jersey
Edwin D. Lillie, Microelectronics and Computer Technology Corporation, Austin, Texas
Robert C. Sundahl, Intel Corporation, Chandler, Arizona
June 2014
154
December 1989
Paperback
9781107410398
Paperback
Hardback
Product details
December 1989Hardback
9781558990272
522 pages
229 × 152 × 29 mm
0.86kg
Available
Often bought together
Often bought together

Related Journals
Powder Diffraction
: Journal
Powder Diffraction is a quarterly journal published by the JCPDS-International Centre for Diffraction Data through Cambridge University Press. Powder Diffraction is a journal of practical technique, publishing articles relating to the widest range of application—from materials analysis to epitaxial growth of thin films and to the latest advances in software. Although practice is emphasized, theory is not neglected, especially as its discussion relates to better understanding of technique.2015 Impact Factor: 0.763
Related Journals
Also by this Author
- Ralph Jaccodine , Lehigh University, Pennsylvania
- Kenneth A. Jackson , AT&T Bell Laboratories, New Jersey
- Edwin D. Lillie , Microelectronics and Computer Technology Corporation, Austin, Texas
- Robert C. Sundahl , Intel Corporation, Chandler, Arizona
Editors
Browse by related subject
- Aerospace engineering
- Biomedical engineering
- Chemical engineering
- Circuits and systems
- Civil and environmental engineering
- Communications, information theory and signal processing
- Computer engineering
- Control systems and optimization
- Electromagnetics
- Electronic, optoelectronic devices, and nanotechnology
- Energy technology
- Engineering design, kinematics, and robotics
- Engineering mathematics and programming
- Engineering: general interest
- Image processing and machine vision
- Industrial manufacturing, and operations engineering
- Materials science
- Polymer science and engineering
- RF and microwave engineering
- Solid mechanics and materials
- Technology management
- Thermal-fluids engineering
- Wireless communications