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Integration Techniques for Micro/Nanostructure-based Large-Area Electronics

Integration Techniques for Micro/Nanostructure-based Large-Area Electronics

Integration Techniques for Micro/Nanostructure-based Large-Area Electronics

Carlos García Núñez, University of Glasgow
Fengyuan Liu, University of Glasgow
Sheng Xu, University of California, San Diego
Ravinder Dahiya, University of Glasgow
November 2018
Available
Paperback
9781108703529
£20.00
GBP
Paperback
USD
eBook

    Advanced nanostructured materials such as organic and inorganic micro/nanostructures are excellent building blocks for electronics, optoelectronics, sensing, and photovoltaics because of their high-crystallinity, long aspect-ratio, high surface-to-volume ratio, and low dimensionality. However, their assembly over large areas and integration in functional circuits are a matter of intensive investigation. This Element provides detailed description of various technologies to realize micro/nanostructures based large-area electronics (LAE) devices on rigid or flexible/stretchable substrates. The first section of this Element provides an introduction to the state-of-the-art integration techniques used to fabricate LAE devices based on different kind of micro/nanostructures. The second section describes inorganic and organic micro/nanostructures, including most common and promising synthesis procedures. In the third section,different techniques are explained that have great potential for integration of micro/nanostructures over large areas. Finally, the fourth section summarizes important remarks about LAE devices based on micro/nanostructures, and future directions.

    Product details

    November 2018
    Paperback
    9781108703529
    75 pages
    230 × 150 × 5 mm
    0.2kg
    24 b/w illus.
    Available

    Table of Contents

    • 1. Introduction
    • 2. Nanostructures
    • 3. Large-area printing and integration
    • 4. Conclusions.
      Authors
    • Carlos García Núñez , University of Glasgow
    • Fengyuan Liu , University of Glasgow
    • Sheng Xu , University of California, San Diego
    • Ravinder Dahiya , University of Glasgow