Materials Reliability in Microelectronics IV
Materials Reliability in Microelectronics IV
Volume 338:
Peter Børgesen, Cornell University, New York
John C. Coburn, E.I. duPont de Nemours & Co., Inc Wilmington, Delaware
William F. Filter, Sandia National Laboratories, Albuquerque
John E. Sanchez, Jr., Advanced Micro Devices, Sunnyvale
Kenneth P. Rodbell, IBM T J Watson Research Center, New York
John C. Coburn, E.I. duPont de Nemours & Co., Inc Wilmington, Delaware
William F. Filter, Sandia National Laboratories, Albuquerque
John E. Sanchez, Jr., Advanced Micro Devices, Sunnyvale
Kenneth P. Rodbell, IBM T J Watson Research Center, New York
October 1994
338
Hardback
9781558992382
$28.99
USDHardback
Product details
October 1994Hardback
9781558992382
0 pages
1.045kg
Out of stock in print form with no current plan to reprint
