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Rapid Thermal and Integrated Processing IV

Rapid Thermal and Integrated Processing IV

Rapid Thermal and Integrated Processing IV

Volume 387:
Steven R. J. Brueck, University of New Mexico
Jeffrey C. Gelpey, AST Elektronik U.S. Peabody, Massachusetts
Ahman Kermani, CVC Products Inc. Fremont
Jorgé L. Regolini, France Telecom, Meylan
James C. Sturm, Princeton University, New Jersey
October 1995
387
Out of stock in print form with no current plan to reprint
Hardback
9781558992900
$28.99
USD
Hardback

    The fourth in a continuing series on rapid thermal processing (RTP), this volume addresses work in traditional RTP processes such as dielectric growth, annealing and silicides, as well as developments in integrated processes. The primary focus, however, is the manufacturing aspects of RTP and the successful integration of RTP into production semiconductor fabs. Emphasis is placed on process and equipment modelling and the critical aspects of RTP, such as temperature measurement, uniformity and control. Topics include: modelling, sensors and control; integrated processing and manufacturing; dielectrics; epitaxy, polysilicon and devices; and junctions, metallization and contacts.

    Product details

    October 1995
    Hardback
    9781558992900
    455 pages
    0.795kg
    Out of stock in print form with no current plan to reprint
      Editors
    • Steven R. J. Brueck , University of New Mexico
    • Jeffrey C. Gelpey , AST Elektronik U.S. Peabody, Massachusetts
    • Ahman Kermani , CVC Products Inc. Fremont
    • Jorgé L. Regolini , France Telecom, Meylan
    • James C. Sturm , Princeton University, New Jersey