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Electronic Packaging Materials Science VII

All titles
Electronic Packaging Materials Science VII

Electronic Packaging Materials Science VII

Volume 323:
Peter Børgesen, Cornell University, New York
Klavs F. Jensen, Massachusetts Institute of Technology
Roger A. Pollak, IBM T J Watson Research Center, New York
June 2014
323
March 1994
Out of stock in print form with no current plan to reprint
Paperback
9781107409422
$35.99
USD
Paperback
USD
Hardback
    Description

    Product details

    March 1994
    Hardback
    9781558992221
    472 pages
    229 × 152 × 25 mm
    0.8kg
    Temporarily unavailable - available from TBC

    Often bought together

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    About the authors
      Editors
    • Peter Børgesen , Cornell University, New York
    • Klavs F. Jensen , Massachusetts Institute of Technology
    • Roger A. Pollak , IBM T J Watson Research Center, New York

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