Our systems are now restored following recent technical disruption, and we’re working hard to catch up on publishing. We apologise for the inconvenience caused. Find out more

Recommended product

Popular links

Popular links


Thin Films: Stresses and Mechanical Properties IX

Thin Films: Stresses and Mechanical Properties IX

Thin Films: Stresses and Mechanical Properties IX

Volume 695:
Cengiz S. Ozkan, University of California, Riverside
L. Ben Freund, Brown University, Rhode Island
Robert C. Cammarata, The Johns Hopkins University
Huajian Gao, Max-Planck-Institut für Metallforschung, Germany
No date available
695
Paperback
9781107412064
Paperback

    This book, the ninth in a popular series from the Materials Research Society, is strengthened by invited and contributed papers covering a wide range of subjects, from processing-microstructure-mechanical property relationships, strain effects and self-organization in thin films, nanoscale defects and thermomechanical behavior of materials, to novel nanscale materials testing. While the collection continues the series theme of materials science related modeling and characterization of mechanical properties of materials, special focus is given to: strain relaxation and strengthening mechanisms; defects formation; mechanical properties and nanoscale testing; adhesion and fracture; thin-film applications in MEMS; computational modeling and experiments; and film deposition, microstructure, evolution and intrinsic stress.

    Product details

    No date available
    Paperback
    9781107412064
    532 pages
    229 × 152 × 27 mm
    0.71kg
      Editors
    • Cengiz S. Ozkan , University of California, Riverside
    • L. Ben Freund , Brown University, Rhode Island
    • Robert C. Cammarata , The Johns Hopkins University
    • Huajian Gao , Max-Planck-Institut für Metallforschung, Germany