Materials Reliability Issues in Microelectronics
Materials Reliability Issues in Microelectronics
Volume 225:
James R. Lloyd, Digital Equipment Corporation, Hudson, Massachusetts
Frederick G. Yost, Sandia National Laboratories, Albuquerque, New Mexico
Paul S. Ho, IBM T J Watson Research Center, New York
Frederick G. Yost, Sandia National Laboratories, Albuquerque, New Mexico
Paul S. Ho, IBM T J Watson Research Center, New York
No date available
225
Paperback
9781107409873
Paperback
With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation. Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.
Product details
No date availablePaperback
9781107409873
388 pages
229 × 152 × 20 mm
0.52kg
