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High-Mobility Group-IV Materials and Devices

High-Mobility Group-IV Materials and Devices

High-Mobility Group-IV Materials and Devices

Volume 809:
Matty Caymax, IMEC, Leuven, Belgium
Ken Rim, IBM T J Watson Research Center, New York
Shigeaki Zaima, Nagoya University, Japan
Erich Kasper, Universität Stuttgart
Paulo F. P. Fichtner, Universidade Federal do Rio Grande do Sul, Brazil
June 2014
809
Unavailable - out of print
Paperback
9781107409248
Out of Print
Paperback
Hardback

    In the ever more-demanding quest for increased performance in the microelectronics industry, device concepts such as fully depleted SOI MOSFETs and multiple-gate structures are probably the last step in plain Si technology. In order to keep pace with Moore's law, materials that show enhanced carrier mobilities for both holes and electrons are needed in order to enhance drive in both low-power and high-performance MOS applications. It is clear that the semiconductor community is considering the use of strained layers of SiGe and Si in their most advanced MOS device concepts. This book, first published in 2004, brings together researchers interested in strained SiGe, strain-relaxed buffers, strained Si on bulk Si and on SOI, SiGe on SOI, Ge substrates, and Ge on insulator. Topics include: strained Si and SRBs on bulk Si; strained Si and SRBs on insulator; characterization and defects in strained layers; Ge substrates; strained Si and SiGe devices; doping and diffusion on Group-IV materials; and SiGe layers and high-k and high-mobility substrates.

    Product details

    June 2014
    Paperback
    9781107409248
    322 pages
    229 × 152 × 17 mm
    0.43kg
    Unavailable - out of print
      Editors
    • Matty Caymax , IMEC, Leuven, Belgium
    • Ken Rim , IBM T J Watson Research Center, New York
    • Shigeaki Zaima , Nagoya University, Japan
    • Erich Kasper , Universität Stuttgart
    • Paulo F. P. Fichtner , Universidade Federal do Rio Grande do Sul, Brazil