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Advanced Metallization Conference 2008 (AMC 2008)

Advanced Metallization Conference 2008 (AMC 2008)

Advanced Metallization Conference 2008 (AMC 2008)

Volume 24:
Mehul Naik, Applied Materials Inc., Santa Clara
Roey Shaviv, Novellus Systems, Inc., San Jose
Takashi Yoda, Toshiba Corporation, Yokohama
Kazuyoshi Ueno, Shibaura Injstitute of Technology, Tokyo
January 2009
24
Out of stock in print form with no current plan to reprint
Hardback
9781605111254
£75.99
GBP
Hardback

    The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.

    Product details

    January 2009
    Hardback
    9781605111254
    769 pages
    235 × 158 × 43 mm
    1.15kg
    Out of stock in print form with no current plan to reprint
      Editors
    • Mehul Naik , Applied Materials Inc., Santa Clara
    • Roey Shaviv , Novellus Systems, Inc., San Jose
    • Takashi Yoda , Toshiba Corporation, Yokohama
    • Kazuyoshi Ueno , Shibaura Injstitute of Technology, Tokyo