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Advanced Electronic Packaging Materials

All titles
Advanced Electronic Packaging Materials

Advanced Electronic Packaging Materials

Volume 167:
Andrew T. Barfknecht, Conducrus, Inc., Sunnyvale, California
C. Julian Chen, IBM T J Watson Research Center, New York
Che-Yu Li, Cornell University, New York
Julian P. Partridge, IBM T J Watson Research Center, New York
April 1990
167
Out of stock in print form with no current plan to reprint
Hardback
9781558990555
£22.99
GBP
Hardback
    Description

    Product details

    April 1990
    Hardback
    9781558990555
    0 pages
    0.818kg
    Out of stock in print form with no current plan to reprint

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      Editors
    • Andrew T. Barfknecht , Conducrus, Inc., Sunnyvale, California
    • C. Julian Chen , IBM T J Watson Research Center, New York
    • Che-Yu Li , Cornell University, New York
    • Julian P. Partridge , IBM T J Watson Research Center, New York

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